● 講師介紹：
宋復斌, 博士, 于2002年和2007年在北京航空航天大學（BUAA）和香港科技大學（HKUST）分別獲得材料學碩士及機械工程博士學位。2002-2004年之間，他任職于摩托羅拉半導體事業(yè)部（現(xiàn)為飛思卡爾半導體）從事電子產(chǎn)品封裝方面的開發(fā)及研制。2004-2012年之間，宋復斌博士在香港科技大學先進微系統(tǒng)封裝中心電子封裝實驗室任職為資深/總工程師和香港科大深圳電子材料與封裝實驗室的資深研究員。他的研究領域覆蓋了封裝材料的開發(fā)測試、電子器件的可靠性研究和失效分析等。目前主要負責先進制造工程和質(zhì)量改善解決方案等工作。宋博士是美國國際電機電子工程師學會（IEEE）, 表面組裝技術協(xié)會(SMTA) 和美國機械工程師學會（ASME）會員，以及美國質(zhì)量學會(ASQ)的資深會員。他在國內(nèi)外學術期刊及會議論文集上發(fā)表了超過50篇技術論文并多次獲得最佳論文獎，且與其他研究學者合作撰寫了兩本微電子封裝與組裝方面的書章。
Dr. Fubin SONG received his Ph.D degree in Mechanical Engineering from the Hong Kong University of Science & Technology (HKUST) in 2007 and M.S. degree in Material Science & Engineering from Beijing University of Aeronautics and Astronautics (BUAA) in 2002. From 2002 to 2004, he was with Division of Motorola's Semiconductor Products Sector (now Freescale Semiconductor) in advanced electronic packaging and development. From 2004 to 2012, Dr. Song was the senior / chief technical officer in Center for Advanced Microsystems Packaging (CAMP)/Electronic Packaging Laboratory (EPACK)/HKUST, responsible for advanced packaging related process development, failure analysis and solder joint reliability. He also served as a senior research fellow of HKUST Shenzhen Electronic Materials & Packaging Laboratory from 2009 to 2012. Currently, responsible for advanced engineering and quality solution. He has published over 50 technical papers in international journals/conferences and received several best paper awards, including Best International Conference Paper Award from IPC APEX, Outstanding Paper Award from ICEP, and Best Paper Award of SMTA China South Technology Conference 2011, etc. He also wrote two chapters for books on the solder joint reliability.
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